Technical Summary

In the case of adhering single wafer (sheet shaped) film, peeling of the separator or protection film may be needed before adhering.  We have developed a new film stripping technology which allows for the peeling of the separator and protection film adhered to the edge of the film of the same size without damaging the film. We have achieved a continuously stable operating rate by allowing for multiple peeling profiles to deal with variation in the peeling strength of a lot.